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Abstract: This application note discusses Maxim Integrated's BGA packages, and provides PCB design and board assembly process guidelines. Introduction. The standard BGA packaging process begins by dispensing epoxy on the substrate where the die is to be attached. For more advanced substrate designs, The traditional whisker-free SnPb reflow process is not compatible with Pb-free Pb-free BGA balls. Because Pb-free reflow demands higher.BGA Math. ✍ Calculate BGA routing layer requirements. ✍Select ball size. ✍Subtract ball size from ball pitch. ✍Calculate number of traces between pads. The Ball Grid Array (BGA) package achieves these objectives by The BGA surface mount assembly process flow includes: • PCB plating requirements.